Transport Systems - Buffer

A countermeasure against bottlenecks in the SMT line, the buffers are distinguished into good PCB buffering and NG PCB stacking functions

Intelligent Platform to Realize Fully Automated Process Optimization: Smart Factory

Printer Closed Loop (optional)

Real time communication of printing process monitoring data with Screen Printers
Supports pick-and-place process optimization by controlling panels containing defects
Less Human Intervention
Live Feedback without Sarcrificing Cycle Time
Printing Quality Improvement
Yield Improvement

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

Carry out essential analyses from an intuitive graphical interface
Accelerate root cause analysis for increased equipment uptime

Link @KSMART (optional)

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Brochure - PDF

Real-Time Warp Compensation

Z-tracking 3D Compensation

The KY8030-2’s moiré technology enables realtime measurement and compensation of board warp, solving the PCB Warp issues with respect to the ideal plane that impact inspection accuracy and reliability.

Automated Solder Paste Dispensing: Auto-Repair (optional)

KY8030-2 adds automated solder paste dispensing as an optional add-on. The high-precision, userfriendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The KY8030-2’s automatic dispensing option repairs such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Koh Young Process Optimizer (optional)

The KSMART Process Optimizer assists with real-time communication of monitoring data from the screen printing processes including insufficient paste, excessive paste, shape deformity based on 3D volume and shape measurements, as well as instances of no paste, bridging, and placement errors.

Real-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre-DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing

results following application of recommended parameters resulting in significant print quality improvements and increased yield.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

‍

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Brochure - PDF

Real-Time Warp Compensation

Z-tracking 3D Compensation

The KY8030-3’s moiré technology enables realtime measurement and compensation of board warp, solving the PCB Warp issues with respect to the ideal plane that impact inspection accuracy and

Pad Referencing 2D Compensation

The high-quality IR light provides for automatic for fast and easy reference teaching even without the CAD file. Moreover, the KY8030-3 allows manufacturers to match non-inspection objects (patterns and fiducial marks) on ideal PCB stencil designs with the ideal PCB pad ocations defined by the CAD file in real time with minimum hassle.

Automated Solder Paste Dispensing: Auto-Repair (optional)

KY8030-2 adds automated solder paste dispensing as an optional add-on. The high-precision, userfriendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The KY8030-2’s automatic dispensing option repairs such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Koh Young Process Optimizer (optional)

The KSMART Process Optimizer assists with real-time communication of monitoring data from the screen printing processes including insufficient paste, excessive paste, shape deformity based on 3D volume and shape measurements, as well as instances of no paste, bridging, and placement errors.

Real-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre-DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing

results following application of recommended parameters resulting in significant print quality improvements and increased yield.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

‍

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Brochure - PDF

Library Manager @ KSMART

Job Management

aSPIre 3 stores and distributes job files and inspection conditions from its centralized DB to multiple SPIs ensuring easy management of modifications and changes following process optimization.

User Level Management

aSPIre 3 has the ability to set up user level groups with various authorities ensuring that the work history of each user is monitored through the user’s data logs.

Link @KSMART (optional)

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI System

Auto-Verification (optional)

Uphold Optimal Machine Conditions

aSPIre 3 offers periodical checks on critical items such as 3D/2D light intensity, PZT Feed, Height Accuracy, and XY Offset. It helps operators to take precautionary measures so that SPI can maintain optimal conditions.

Improve Operational Efficiency

aSPIre 3 also minimizes maintenance through auto-verification of machine conditions during operation to reduce process interruptions and enhance equipment uptime.

Real Time Monitoring (optional)

Process Optimization

aSPIre 3 provides analysis of real-time multi-line management data, enabling the comparison of each machine and line, while allowing for management of machine status for all production lines from remote locations.

Multi-line Production Info

aSPIre 3 provides a detailed history chart, height, volume, and offset for designated lines by ensuring the best products that yield the available machine ranking. It shows machine stats, model information, yield, and alarm time.

Brochure - PDF

Perfecting Inspection Performance with True 3D

Measurement & Inspection of an Array of Defects

Zenith has the ability to make a clear and concise ‘go-or-no-go’ decision for a solder joint inspection, detecting an array of potential defects including Missing solder, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

Template Management for Fast and Intuitive Programming

Zenith’s intuitive interface makes setup easy, reducing programming time in package registration and setting of inspection conditions. The evaluation benchmark can then be easily managed by an operator, simplifying and speeding up programming, while also making identification universal.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

OPO (Offline Program Optimizer) @KSMART (optional)

Job Fine-tuning with Minimum Downtime

The Offline Program Optimizer makes program creation, debugging and updates seamless, allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without stopping the production line or altering the production schedule.

Link @KSMART

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI Systems

AI-Driven Auto Programming for Rapid Job Programming

The optimized, user-friendly graphic interface is simple to use with flexible, custom configurations as well as AI-driven measuring of selected components that proposes recommended inspection conditions from KY Templates built by AOI experts. This allows for simple, seamless and super-fast auto programming that guarantees true-to-life 3D inspection, yielding a 70% reduction in programming time.

Side-View Camera Solutions for Expanded Inspection Capabilities

KY’s side-view camera solution allows Zenith2 to quickly detect and analyze defects on a wide range of mounted components and chips

Enhanced Auto-Verification Capabilities for Low TCoO

Self diagnosis of lighting and calibration ensures an optimal environment & lower TCoO.

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Increases equipment uptime by helping operators perform critical process analyses and optimize default settings from an intuitive graphical interface.

The Library Manager stores inspection conditions and real-time job files in a centralized database and distributes the data to multiple machines.

The Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune processes starting from the next PCB without altering the production schedule.

Links all inspection results, merging images, trends, charts and inspection results including detailed analysis from the SPI, pre-reflow AOI and post-reflow AOI for total line communication and process analysis.

SPC @KSMART (optional)

Reliable 3D Data based Statistical Process Control

The KY8030-2 also comes with a reliable 3D-Data based Statistical Process Control which lets manufacturers evaluate data using an intuitive graphic interface. It also helps increase the speed of root-cause analysis to provide users with enhanced equipment uptime.

SPC Dashboard Inspection Analysis

Link @KSMART (optional)

3D data based SPI-AOI communication solution

Review, diagnosis and optimization of printing, pick-and-place and reflow process
Traces root cause of defects by storing and communicating inspection results from Koh Young’s 3D SPI and 3D AOI Systems

Automatic Inspection Solutions for CNC / Assembly Process

True 3D Measurement for CNC and Assembly Process

Patented moiré projection technology enables true 3D measurement on CNC / Assembly Process

Micro 3D measurement capability based on Koh Young’s unrivalled accuracry

Monitoring CNC / Assembly Process

Unique measurement inspection for CNC / Assembly Process

Reliable Surface Defect Identification

– Height Repeatability : 20um at 3 sigma on KY calibration taget

– Length Repeatability : 20um at 3 sigma on KY calibration target

– Metrology Capability : Area, Height, Diameter, Volume

– Types of Defects : Scratch, Flaw, Stain, Burr, Missing, Color, Coplanarity and more

Provide Figure & Exterior 3D inspection simutaneously for maximize productivity

Less than 10 min. programming for a complete inspection file with No fine tunning needed

Neptune T

Measurement of transparent and semi-transparent material thickness
Side view of non-transparent material profile
Classification of the real signals from the raw images

Neptune T

Measurement of conformal coating thickness of various places
Coatings on PCB board, solder joint, lead top and THT application.

Neptune T

Measurement of diameter and height of the lens
Capable to identify the lens profile

Neptune T

Identify the scratches on the filling in the pressure sensor
Capable to identify and measure the coating around the chip in the pressure sensor
Measurement of the height of the
filling and the chip.

Neptune T

Measurement of the height and width of the underfill
Capable to reconstruct the profile of the underfill in 3D with several structures

Tower(Rack)

Individual belt operations type

PCB 20 slots (±15mm)

Tower(Rack)+NG Conveyor

Individual belt operations type

Visual identification of NG PCB

PCB 20 slots (±15mm)

Identifier and RS-232C communications module allow easy identification of NG points (optional)

Magazine Buffer

Accommodates single-size racks

Mode : Loader / Unloader

NG stacking / Buffering

By pass

Combi - Magazine

Individual belt operations type

Fast cycle

Buffering + NG stacking

Accepts one magazine rack

PCB 20 slots (±15mm)

Destacker-Knife

Separates PCB sheets with a blade

Maximum PCB load of 30 kg

Destacker-Clamp

Separates PCB sheets with clamping

Maximum PCB load of 50 kg

Vacuum Loader - Edge

Fixed vacuum pad

Maximum PCB load of 50 kg

Valve manual lock

Push-up Stacker

Suitable for off-line laser line

Magazine Unloader

Accommodates single-size racks

Magazine Unloader-All type

Accommodates multiple rack sizes

Magazine Unloader - Single

Accommodates multiple rack sizes

Accommodates single rack

Designed for limited spaces

Shuttle Unloader

Accommodates multiple rack sizes

Accommodates two magazine racks

Single shuttle integral type

Designed for limited spaces

Magazine Loader

Accommodates single-size racks

Magazine Loader-All type

Accommodates multiple rack sizes

Magazine Loader - Single

Accommodates multiple rack sizes

Accommodates single rack

Designed for limited spaces

Shuttle Loader

Accommodates multiple rack sizes

Accommodates two magazine racks

Single shuttle integral type

Designed for limited spaces

High quality printing

Printing at the correct position, with the correct amount, in the correct shape

Repeated alignment accuracy ±10µm(6σ)

Better responsiveness to positioning the mask results from the lighter-weight offsetting mechanism with reduced sliding resistance in addition to advanced image recognition accuracy for fine marks that is driven by the high resolution camera.
This brings a high level of alignment performance with stable printing quality.

Using the appropriate print pressure

It is essential to apply the appropriate pressure to print the correct volume of solder. Our real-time print pressure feedback control and newly developed squeegee head stabilize the print pressure at all times and maintain the angle of the squeegee edge.
This ensures the correct volume of solder.

Printing shapes with sharp outlines

Taking into account the solder fluidity during snap-off, snap-off operation has optimized acceleration control.
This makes solder deposits in apertures transfer onto panels in the correct shape.

Reducing print deviations caused by stretched masks

The renewed vacuuming mechanism improves the panel and mask adhesion.
This eliminates print defects caused by stretched masks.

Preventing solder from escaping

The mechanism to reduce the amount of solder escaping from the printing squeegee lowers the volume of escaped solder substantially.
This leads to a higher rate of utilization of solder.
While this results in using fresh solder which furthers the stability of print quality, it also reduces solder collection and cleaning work.

No line stops for quality-related errors

Based on inspection result feedback from SPI machines, automatic offsetting is implemented in the printing conditions based on a prediction of future printing problems such as solder volume deviations, misalignment, and smearing.
This helps maintain high quality printing.
* Option

- Automatic mask positioning adjustment
- Mask condition visualization by mark camera
- Solder supply instructions
- Automatic cleaning
- Automatic production stops

Support for various production types

Building production lines with the flexibility to handle various types of production

Making changeover work hands free

High accuracy printing for supporting fine patterns

Highly rigid design and stable position correction mechanism enable a highly accurate repetitive panel alignment accuracy of 10 μm (6σ Cpk ≥ 2.0).

Preventing stencil deflection during printing Mask vacuum*

By using vacuum pressure to secure the metal stencil from the underside and keeping it in close contact with the panel, deflection of the metal stencil during printing is prevented and stable print quality can be maintained.

Secure clamping of diversified panels Hybrid clamping mechanism*

Stable clamping is achieved by using hybrid clamping*, which allows users to select the optimum clamping method (side clamp/top clamp/edge clamp) according to the characteristics of the panel.

Delivering high accuracy printing control

Unevenness along the panel and stencil are detected in real time using a load cell attached to the squeegee head, and the pressure is controlled so that it remains uniform during printing.

Accurate backup pin allocation Automatic backup pin allocation*

The backup pins are positioned automatically at the locations specified in the production program.
This reduces workload required for changeover, preventing defective panels resulting from human error.

Printing consistently with the appropriate solder volume Solder roll diameter detection*

After print operation the volume of solder is measured, prompting solder to be supplied when required. This means that the solder roll is kept at the optimal diameter for stable printing quality.

Preventing the wrong materials from being used*

The IDs of the materials used in production are verified against the IDs of the materials specified in the production program, preventing the use of the wrong materials.

It is possible to choose between two methods; using the data from Integrated Production System - Nexim, or using the data stored in the GPX-CII itself.

Applicable materials: Solder, metal stencil, backup block, squeegee

Traceability support*

Traceability data can be acquired for each panel ID.

It is possible to choose between two methods; using the data from Integrated Production System - Nexim, or using the data stored in the GPX-CII itself.

Maintaining printing quality by linking with SPI Feedback control between SPI and printer*

Inspection results are received from the SPI, and the appropriate response to trends that show a change in conditions can be performed automatically.
Because changes such as positional deviations and smeared or missing solder are responded to before they lead to problems, high-quality solder printing is maintained.

Significant reduction in time taken to ramp-up production for new models*

The printing parameters are extracted from the database, giving the optimal printing conditions. The difference in work times between operators of differing levels of skill and experience is eliminated, reducing the time taken to start production.

Adjustable stencil frame size support*

The width of the metal stencil frame can easily be changed to match the size of the metal stencil.
With the slide mechanism there is no need for dedicated adapters, reducing the amount of preparation work required when producing panels with differing stencil sizes on the same line.

Squeegees with adjustable angles*

The angle of the squeegee can be easily adjusted against the indicators on the squeegee holder, without needing to remove the squeegee.

Reducing the physical load placed on operators

The machine has a front cover that provides easy access, reducing the load placed on operators during changeover and resupply.

Asterisks (*) denote option functions
Some functions are not supported on GPX-CSII and GPX-CL
Contact Fuji for more details.

Further expanded capability

Even though the machine size is compact, it is also flexible and a wide range of production operation is possible with the machine's extensive capacity.

Placement heads that demonstrate strong capability in production

AIMEXR uses the same state-of-the-art heads as NXTR. By expanding the range of parts that can be supported, they contribute to line balancing and flexible production without drops in production rates even when a different set of parts is used in the next production.

Greater support for large panels

The possible placement area can be expanded up to the maximum panel size of 1,068 x 610 mm. The machine supports a wide range of applications, from LED placement and automotive panels, to the large panels required for communication infrastructure.

Minimize changeover with large capacity part supply units

With the large capacity part supply units the machine can hold up to 130 different part types. Shared setups that utilize the large quantity of loaded parts reduce the changeover frequency and operator work loads.

Full production

Program changes due to sudden production changes and data editing for vision processing errors during production can be supported immediately on the machine. On-machine functions that support editing programs reduce the lead time to ramping up production.

High quality placement

Always maintain correct placement by checking the conditions of electronic parts and panels using real time sensing technology and then reflecting check results to the machine. This maintains stable placement quality.

Offers high accuracy placement as standard

Placements can be performed with a high accuracy of ±25 µm at all times; there are no constraints for the head type or the part to be placed. Additionally, the machine controls the push-in amount during placement and places with the appropriate pressure.

Not affected by changes in the surface height

Reliable placement is attained by detecting and adjusting for the panel warpage and individual part differences using advanced functions. Maintain productivity and support even large panels for which it is easy for the warpage to be large (up to 7 mm).

Checks for tombstoned, missing, and upside-down parts

The installed IPS system can cater to a wide range of checks, from part pickup stance to parts remaining on nozzles, as well as upside-down checks for minimold parts. It prevents placement defects attributed to packaging, nozzles, and parts.

Prevents defects associated with part properties

Placement defects caused by operation errors and defective parts are prevented by checking the electrical properties of chip parts with LCR checks and by checking the leads and bumps on IC parts with coplanarity checks. (Option)

The fastest in the history of the series

Achieves the fastest placement speed in the history of the series by using advanced XY robots with linear motors. Even greater improvements in area productivity can be expected.

Stable operation

Support for production that enables non-stop operation and quick recovery. This can help minimize line stoppage, improving operation rates.

Towards non-stop production

AIMEXR saves log and image data automatically. Resolutions can be reached quickly whenever problems occur by making use of this information.
If there is a network problem, production can be continued using the program information stored inside the machine. This yet-to-be-released feature will make it possible to avoid sudden stops at the production line.

Automatic, easy, and reliable maintenance offline

Nozzles, feeders, and also heads are applicable for offline maintenance. Using automation units ensures reliable maintenance without requiring any skills. Linking these units with Nexim improves maintenance management.

SDGs

The machine power consumption has been reduced by 10%^*by using highly efficient motors.
We are also reviewing our coating processes and efforts are being made to reduce the environmental impact.
* Measured under conditions at Fuji.
Sample machine configurations

High speed placement of small chip parts

Production method: Dual lane production^*
Supported panel size: 48 x 48mm to 1,068 x 280mm
Supported part size: 0201 (008004") to 7 x 7 mm, height: 6.5 mm
* Under development

Placement for medium to large parts and odd-form parts

Production method: Single lane production
Supported panel size: 48 x 48mm to 1,068 x 610mm
Supported part size: 0402 (01005") to 180 x 35 mm^*, height: 38.1 mm
* Maximum part sizes include 135 x 120, 175 x 50, and 167 x 74 mm in addition to the above.

Modular concept

This machine continues the concept of true modularity from the NXT series.
This true modularity is a unique feature to Fuji and none of our competitors can match it.

Exchange heads in a single action

Fuji's original compact lightweight heads can be easily exchanged without using tools.
This allows operators to perform maintenance and troubleshoot unexpected problems.

Build module configurations to be optimal for your production

The types of modules and heads to be used can be selected to match your product, and modules can be switched out even after setting up production lines, giving you the optimal production equipment.

Units for supporting various usages

You can select the optimum supply units to match the production type and parts used.
Feeders and other supply devices from other Fuji products you may have can also be used, encouraging efficient use of the units in your assets.

Even greater improvements in productivity

The 2RV module allows for production enhancement focused on high-speed placement of small parts (productivity priority mode: 60,000 cph).

Simple work paths for efficiency

The modules are designed for single side operation that streamlines and optimizes the operation traffic.
This increases efficiency in supplying materials and performing maintenance work.

Minimal investment per module

Additional investment can be made on the scale of single modules.
You can gradually increase the production capacity to the necessary extent with minimal investment for each.

High quality placement

Maintaining a high level of quality on all placements

Offers high accuracy placement

Placements can be performed with an accuracy of ±25 µm at all times without constraints for the head type or the parts to be placed. For parts requiring higher accuracy, placement with an accuracy of ±15 µm is possible by using heightened accuracy mode.
Additionally, controlling the push-in amount during placement allows for placement with the appropriate pressure.

Places parts in a way that they are not affected by changes in the placement surface height

Adjusting the placement height

The placement stroke follows changes in the placement height due to panel warpage and distortions, which allows the machine to control the appropriate push-in amount and moreover prevents placement deviations and excess stress on parts and panels.

Checks placement within placement machines

Mark and parts inspection (MPI)

Various checks are available within placement machines to verify the process result shortly after that process: Checking placement immediately following placement, and checking placed parts before placing shield parts, for example. This prevents production of defective products and reduces wasted time and parts.

- Part presence check
- Misaligned placement check
- Part direction check (Under development)

Checks for tombstoned, missing, and upside-down parts

Intelligent parts sensor (IPS)

The installed IPS system can cater to a wide range of checks, from part pickup stance to parts remaining on nozzles, as well as upside-down checks for minimold parts.
It prevents placement defects attributed to packaging, nozzles, and parts.

- Check for dropped parts
- Check of the part height
- Check for parts presence
- Check for parts remaining on nozzle
- Check for stuck nozzles

Prevents defects associated with part properties

LCR check, 3D coplanarity checkPlacement defects caused by operation errors and defective parts are prevented by checking the electrical properties of chip parts with LCR checks and by checking the leads and bumps on IC parts with coplanarity checks. (Option)

Places WL-CSPs with high accuracy

The camera equipped with advanced lighting technology, ensures reliable vision processing of WL-CSPs and other parts for which the background of parts are likely to be captured in acquired images. Using a high-resolution camera enables reliable recognition of bumps as small as 45 µm in diameter. This results in high accuracy placement.

Support for various production types

Building production lines with the flexibility to handle various types of production

Placement heads that demonstrate strong capability in production

The newly-developed heads are capable of handling an expanded part range. They contribute to line balancing and flexible production without drops in production rates even when a different set of parts is used in the next production.

Expanded conveyable panel size

The panel size coverage is expanded so that panels up to 750 x 610 mm are supported "with single conveyors" and up to 370 x 280 mm "with double conveyors" when using dual lane production.
From large panel production to highly-efficient production of producing panels in the same size, NXTR line configurations are capable of supporting a greater variety of production.

World-class speed of placement

Fuji's unique rotary head technology with simultaneous pickup and improved feeder indexing speed provides 60,000 cph per robot.This industry-leading placement speed takes productivity to the next level.

Optimal placement actions tailored to the part

Operation can be optimized in various ways to suit the part being placed, such as by selecting stable and optimal operation speeds and streamlining Z direction strokes in view of the part height. In addition to making it possible to support various parts, this also improves cycle time as well.

- Multi-level transfer speed
- Shortest Z stroke control

Automatic pin allocation even for soft backup pins

The appropriate hard-type or soft-type backup pins are allocated automatically.
This function is an effective measure to reduce work and prevent mistakes during changeover. (Option)

- Program-based positioning
- Auto allocation position check

Evolving manufacturing

Responding to evolving parts and production models, and advancing total line efficiency

Towards non-stop production

By automatically saving logs and image data, signs of issues that would cause machine stops and information that would lead to problem solving are not missed, leading to error prevention and faster recovery times.

Support for a variety of operation types

A wide variety of supply units are available to support various parts including the smallest parts up to large odd-form parts. The MFU is available with a choice between the bucket type and bucket reel type.

Easy maintenance

Pulling forward the module opens up access to the inside the machine with ease from both sides. This makes it possible to exchange heads and other units and perform maintenance work with a comfortable posture.

Automatic, easy, and reliable maintenance offline

Nozzles, feeders, and also heads are applicable for offline maintenance. Using automation units ensures reliable maintenance without requiring any skills. Linking these units with Nexim improves maintenance management.

High-speed flux transfer

The high-speed type dip flux unit transfers flux onto the bumps of small parts. This leads to high-speed placement. (Option)

Collects waste tape automatically

Waste tape is collected automatically into one place to reduce operator work that previously needed to be performed regularly for each module. (Option)

Automatic feeder exchange

Because the Smart Loader performs changeover and part supply according to the schedule, the amount of work at the line side can be reduced and efficient production can be achieved.

Reducing changeover work

By simply setting cassette-type feeders at buffer stations, the Smart Loader automatically exchanges the feeders in production slots and base buffers according to parts out warnings and the changeover schedule.

Production methods utilizing Smart Loader

Smart Loaders exchange feeders during production, preventing production stops. A production method in which parts are supplied from the base buffer during production is effective for mass production. For high-mix, high-volume production, Smart Loaders enable changeover during production by changing the different parts only.

Modular concept

This machine continues the concept of true modularity from the NXT series.
This true modularity is a unique feature to Fuji and none of our competitors can match it.

Exchange heads in a single action

Fuji's original compact lightweight heads can be easily exchanged without using tools. This allows operators to perform maintenance and troubleshoot unexpected problems.

Build module configurations to be optimal for your production

The quantity of robots per module and types of heads used can be selected to match your product, giving you the optimal production equipment.

Minimal investment per module

Additional investment can be made on the scale of single modules. You can gradually increase the production capacity to the necessary extent with minimal investment for each.

Simple work paths for efficiency

The modules are designed for single side operation that streamlines and optimizes the operation traffic.This increases efficiency in supplying materials and performing maintenance work.

High quality placement

Maintaining a high level of quality on all placements

Offers high accuracy placement

Placements can be performed with an accuracy of ±25 µm at all times without constraints for the head type or the parts to be placed. For parts requiring higher accuracy, placement with an accuracy of ±15 µm is possible by using heightened accuracy mode.
Additionally, controlling the push-in amount during placement allows for placement with the appropriate pressure.

Not affected by changes in the surface height

Placement height adjustment

The placement stroke follows changes in the placement height due to panel warpage and distortions, which allows the machine to control the appropriate push-in amount and moreover prevents placement deviations and excess stress on parts and panels.

Checks placement within placement machines

Mark and parts inspection (MPI)Various checks are available within placement machines to verify the process result shortly after that process: Checking placement immediately following placement, and checking placed parts before placing shield parts, for example. This prevents production of defective products and reduces wasted time and parts.- Part presence check- Misaligned placement check- Part direction check (Under development)

Checks for tombstoned, missing, and upside-down parts

Intelligent parts sensor (IPS)

The installed IPS system can cater to a wide range of checks, from part pickup stance to parts remaining on nozzles, as well as upside-down checks for minimold parts. It prevents placement defects attributed to packaging, nozzles, and parts.

- Check for dropped parts
- Check of the part height
- Check for parts presence
- Check for parts remaining on nozzle
- Check for stuck nozzles

Prevents defects associated with part properties

LCR check, 3D coplanarity check

Placement defects caused by operation errors and defective parts are prevented by checking the electrical properties of chip parts with LCR checks and by checking the leads and bumps on IC parts with coplanarity checks. (Option)

Places WL-CSPs with high accuracy

The camera equipped with advanced lighting technology, ensures reliable vision processing of WL-CSPs and other parts for which the background of parts are likely to be captured in acquired images. Using a high-resolution camera enables reliable recognition of bumps as small as 45 µm in diameter. This results in high accuracy placement.

Support for various production types

Building production lines with the flexibility to handle various types of production

Placement heads that demonstrate strong capability in production

The newly-developed heads are capable of handling an expanded part range. They contribute to line balancing and flexible production without drops in production rates even when a different set of parts is used in the next production.

Expanded conveyable panel size

The panel size coverage is expanded so that panels up to 750 x 610 mm are supported "with single conveyors" and up to 370 x 280 mm "with double conveyors" when using dual lane production.
From large panel production to highly-efficient production of producing panels in the same size, NXTR line configurations are capable of supporting a greater variety of production.

World-class speed of placement

Fuji's unique rotary head technology with simultaneous pickup and improved feeder indexing speed provides 60,000 cph per robot.This industry-leading placement speed takes productivity to the next level.

Optimal placement actions tailored to the part

Operation can be optimized in various ways to suit the part being placed, such as by selecting stable and optimal operation speeds and streamlining Z direction strokes in view of the part height. In addition to making it possible to support various parts, this also improves cycle time as well.

- Multi-level transfer speed
- Shortest Z stroke control

Automatic pin allocation even for soft backup pins

The appropriate hard-type or soft-type backup pins are allocated automatically.
This function is an effective measure to reduce work and prevent mistakes during changeover. (Option)

- Program-based positioning
- Auto allocation position check

Load an abundance of parts

Utilizing specialized feeders and base buffers greatly increases the quantity of parts that can be loaded. When combined with the Smart Loader, these support a wide range of production.

Evolving manufacturing

Responding to evolving parts and production models, and advancing total line efficiency

Towards non-stop production

A wide variety of supply units are available to support various parts including the smallest parts up to large odd-form parts. The MFU is available with a choice between the bucket type and bucket reel type.

Easy maintenance

Pulling forward the module opens up access to the inside the machine with ease from both sides. This makes it possible to exchange heads and other units and perform maintenance work with a comfortable posture.

Automatic, easy, and reliable maintenance offline

Nozzles and also heads can have maintenance performed offline. Using automation units ensures reliable maintenance without requiring any skills. Linking these units with Nexim improves maintenance management.

High-speed flux transfer

The high-speed type dip flux unit transfers flux onto the bumps of small parts. This leads to high-speed placement. (Option)

Collects waste tape automatically

Waste tape is collected automatically into one place to reduce operator work that previously needed to be performed regularly for each module. (Option)

NXT Concept

Modular concept that is able to provide the best line every time

Configure lines according to the purpose

Modules, heads, and supply units can be combined freely, so that the optimum line configuration can always be built by changing the configuration to match changes in the part type and product model.

It is possible to expand the capability only for the necessary level by adding modules and exchanging units.

Heads can be exchanged easily

Heads can be exchanged easily without tools.
The heads are lightweight and thus can be removed easily by a machine operator when needing to perform maintenance or troubleshooting when responding to issues.

Single-side operation

Only a short distance is traveled for part supply and changeover, for a simple work path that does not take excessive time or effort.
Production lines can be configured freely into layouts such as back to back or U-shaped lines.

Offline maintenance to maximize production uptime

Because swapping units that require maintenance with units that are fully maintained can be performed at the operator level, downtime can also be greatly reduced. Maintenance can be performed offline on the removed units while production is still running.

ID management

The quantity of robots per module and types of heads used can be selected to match your product, giving you the optimal production equipment.

Automatic calibration

The operator simply pushes the START button after exchanging the head. Heads are calibrated automatically in the machine so that production can resume.

High quality

Maintaining a high level of quality on all placements

Checks tombstoned parts, missing parts, and upside-down parts

A wide range of checks like the following can be performed using the Intelligent Part Sensor (IPS).

· Checks pickup and checks for parts remaining on the nozzle after placement
· Detects tombstoned parts
· Checks part heights
· Checks for upside-down leaded parts

Electrical property checks (LCR checks) of chip parts

The LCR check unit checks the electrical properties of passive parts (inductance coils, capacitors, and resistors) before placement. This prevents parts with the wrong properties from being placed, which cannot be checked based on exterior checks.

3D Coplanarity check that removes faulty parts

All parts are checked before placement to ensure that there are no warped terminals or leads on parts such as connectors and IC chips that can cause poor connectivity, preventing defective parts from being used. It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a part is placed.

Panel warpage check

The panel warp is automatically measured by a laser sensor before placement. Placement is only performed on panels that are within the set tolerance, so that defective panels are stopped before they can be produced.

Low impact placement

Excessive downward push and placing parts above the panel can be prevented by reflecting the part height measured by IPS to the placing surface determined from the amount of panel warpage.
Furthermore, the low impact nozzle of Fuji's original design can prevent the collapse of solder and parts from becoming cracked.

High quality, high density placement at top speed

Very high density part placement of 0201 (008004") parts is supported by standard specification cameras and units. Positioning is corrected as each part following pickup, so that very small parts can be placed with fine pitches at top speed.

High productivity

Building production lines with the flexibility to handle various types of production

Wide range nozzles

Integrate 4 nozzles for multiple parts sizes (0603 (0201"), 1005 (0402"), 1608 (0603"), and 2125 (0805")) into three types (S, M, L). Because nozzles can be shared, the frequency of nozzle exchange is reduced and the cycle time can be improved.

Bringing specific processes inline

By loading dedicated heads and units into the machine, specific processes such as glue application and flux transfer can be performed inline. This contributes to the reduction of incomplete products and removes the need for investing in dedicated equipment.

DX head supporting various types of parts

The DX head automatically exchanges tools based on the part size, from chips to large and odd-form parts, and can be loaded on M6 III modules. When production models are frequently changed and there are changes in the part type mixes, it is possible to adjust the line balance.

Support for placement of various parts

NXT III caters to the placement of various types of parts, supporting from standard to large and odd-form parts, and by handling parts using various methods such as placing large connectors with pressure insertion or parts with clamp pressure control.

67,200 cph/㎡ - World's best productivity per floor area

Area productivity of the machines is extremely important when considering the productivity of the entire factory. NXT III is a leading-edge placement solution that is fast and takes up little space, making it possible to get the best productivity out of limited floor space.

NXT III special lineup

Other products that support further high-speed and realtime load control are also available.

M3 IIISE

17% increase in performance
‍The speed of operations frequently used in actual production has been increased intensively, improving the throughput by 17% compared to previous models.The M3 IIISE module is effective for module part boards, smartphone boards, and other such panels which have high-density part population.

M6 IIIL module, H12L head

Realtime load control
As parts continue to become even smaller, thinner, and lighter the demand for low-impact placement, in addition to placement accuracy, is also increasing.
The combination of the H12L head with the M6 IIIL module makes it possible to control the load during placement in real time. This means that parts can always be placed using the same load regardless of the condition of the panel, preventing damage to parts.

The best floorspace productivity in the industry

One NXT IIIc module occupies just 0.46 m² of floorspace, making it an incredibly compact machine.
Retaining all the advanced features of the NXT III but occupying 35% less area, the NXT IIIc offers the best floorspace productivity in the industry.^* (92,900 cph/m²)
When setting lines back-to-back, the gap between modules can be as small as 60 mm.

*According to research by Fuji as of August 2021.

High capability

Handles large panels and improves productivity with the simultaneous production of two models

Large panel production

Single conveyor configurations can support production for large panels up to 1,068 x 710 mm.
(Panels up to 1,500 mm width can be supported as an option.)

Support for producing two product models simultaneously using double conveyors

It is possible to produce two different models at the same time using a double conveyor, so the panel conveyance time is, in practice, zero. A wider scope of production is possible using twin robot specifications.

Versatility

Versatility for performing high-mix production

Supporting 0402 (01005") to 102 x 102 mm parts placement and glue application by one head

A DX head exchanges dedicated tools in one action depending on the part size, from small chips to large odd-form parts. A glue tool enables the machine to perform glue application in addition to part placement.

Bringing specific processes inline

By loading DX heads and dedicated units into the machine, special processes such as glue application and flux transfer can be performed inline. This contributes to the reduction of incomplete products and removes the need for investing in dedicated equipment.

Support for placement of various parts

The machine caters to the placement of various types of parts, supporting from standard to large and odd-form parts, and by handling parts with clamp pressure control or by using various methods such as placing large connectors with pressure insertion.

Placing a large volume of very small parts in a short time

This machine can be loaded with H24S heads for placing 03015 mm parts with an accuracy of ±0.025 mm. With the two head configuration, the machine can reach up to 80,000 cph using productivity priority mode.

High quality

Functions supporting high quality placement

Checks for tombstoned parts, missing parts, and upside-down parts

A wide range of checks like the following can be performed using the Intelligent Part Sensor (IPS).
· Checks pickup and checks for parts remaining on the nozzle after placement
· Detects tombstoned parts
· Checks part heights
· Checks for upside-down leaded parts

LCR checks of chip parts

The LCR check unit checks the electrical properties of passive parts (inductance coils, capacitors, and resistors) before placement. This prevents parts with the wrong properties from being placed, which cannot be checked based on exterior checks.

3D coplanarity check that removes faulty parts

All parts are checked before placement to ensure that there are no warped terminals or leads on parts such as connectors and IC chips that can cause poor connectivity, preventing defective parts from being used. It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a part is placed.

Panel warpage check

The panel warp is automatically measured by a laser sensor before placement. Placement is only performed on panels that are within the set tolerance, so that producing on defective panels is prevented.

Low impact placement

Excessive downward push and placing parts above the panel can be prevented by reflecting the part height measured by IPS to the placement point determined from the amount of panel warpage.

Furthermore, the low impact nozzle of Fuji's original design can prevent the collapse of solder and parts from becoming cracked.

Simple

Simple functions for handling various part types with ease

Minimizing the changeover count

Changeover time can be reduced by performing MFU batch changeover and by the machine having up to 130 slots for feeders which makes it possible to load all of the required parts.

Wide range nozzles

Integrate 4 nozzles for multiple parts sizes (0603 (0201"), 1005 (0402"), 1608 (0603"), and 2125 (0805")) into three types (S, M, L). Because nozzles can be shared, the frequency of nozzle exchange is reduced and the cycle time can be improved.

Ramping up production smoothly

Automatic data creation and on-machine editing using a large touchscreen panel supports ramping up new production and quick responses to sudden changes in parts and programs.
In addition, automatic data creation featuring ASG 2.0 (Auto Shape Generator 2.0) now covers even those parts with unique shapes that have not been supported in the past. This upgrade is also incorporated in the on-machine editing, the function to update part shape data on the machine, which further reduces the time required for adjustment.

Example machine configurations

Supports various production types with separate use of single and double conveyors

Large panel production
(single robot with single conveyor)

Head: DX x 1Feeder pallet: MFU-65II x 1, Tray unit-LTW2 x 1Conveyor type: Single conveyor

Simultaneous production of two models
(twin robots with double conveyors)

Head: DX x 2
Feeder pallet: MFU-65II x 2
Conveyor type: Double conveyor

Space saving

Makes your high-mix production compact with a simple single conveyor configuration.
Machine size: 1,280 (L) x 2,346 (W) x 1,465 (H) mm

Versatility

Versatility for performing high-mix production

Supporting 0402 (01005") to 102 x 102 mm parts placement and glue application by one head

A DX head exchanges dedicated tools in one action depending on the part size, from small chips to large odd-form parts. A glue tool enables the machine to perform glue application in addition to part placement.

Bringing specific processes inline

By loading DX heads and dedicated units into the machine, special processes such as glue application and flux transfer can be performed inline. This contributes to the reduction of incomplete products and removes the need for investing in dedicated equipment.

Support for placement of various parts

The machine caters to the placement of various types of parts, supporting from standard to large and odd-form parts, and by handling parts with clamp pressure control or by using various methods such as placing large connectors with pressure insertion.

Placing a large volume of very small parts in a short time

This machine can be loaded with H24S heads for placing 03015 mm parts with an accuracy of ±0.025 mm. With the two head configuration, the machine can reach up to 80,000 cph using productivity priority mode.

High quality

Functions supporting high quality placement

Checks for tombstoned parts, missing parts, and upside-down parts

A wide range of checks like the following can be performed using the Intelligent Part Sensor (IPS).
· Checks pickup and checks for parts remaining on the nozzle after placement
· Detects tombstoned parts
· Checks part heights
· Checks for upside-down leaded parts

LCR checks of chip parts

The LCR check unit checks the electrical properties of passive parts (inductance coils, capacitors, and resistors) before placement. This prevents parts with the wrong properties from being placed, which cannot be checked based on exterior checks.

3D coplanarity check that removes faulty parts

All parts are checked before placement to ensure that there are no warped terminals or leads on parts such as connectors and IC chips that can cause poor connectivity, preventing defective parts from being used. It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a part is placed.

Panel warpage check

The panel warp is automatically measured by a laser sensor before placement. Placement is only performed on panels that are within the set tolerance, so that producing on defective panels is prevented.

Low impact placement

Excessive downward push and placing parts above the panel can be prevented by reflecting the part height measured by IPS to the placement point determined from the amount of panel warpage.

Furthermore, the low impact nozzle of Fuji's original design can prevent the collapse of solder and parts from becoming cracked.

Simple

Simple functions for handling various part types with ease

Minimizing the changeover count

Changeover time can be reduced by performing MFU batch changeover and by the machine having up to 130 slots for feeders which makes it possible to load all of the required parts.

Wide range nozzles

Integrate 4 nozzles for multiple parts sizes (0603 (0201"), 1005 (0402"), 1608 (0603"), and 2125 (0805")) into three types (S, M, L). Because nozzles can be shared, the frequency of nozzle exchange is reduced and the cycle time can be improved.

Ramping up production smoothly

Automatic data creation and on-machine editing using a large touchscreen panel supports ramping up new production and quick responses to sudden changes in parts and programs.
In addition, automatic data creation featuring ASG 2.0 (Auto Shape Generator 2.0) now covers even those parts with unique shapes that have not been supported in the past. This upgrade is also incorporated in the on-machine editing, the function to update part shape data on the machine, which further reduces the time required for adjustment.

Example machine configurations

Supports various production types with separate use of single and double conveyors

Simple high-mix production
(single robot with single conveyor)

Head: DX x 1
Feeder pallet: MFU-65II x 1, Tray unit-LTW2 x 1
Conveyor type: Single conveyor

High-speed chip placer
(twin robots with single conveyor)

Head: H24S x 2
Feeder pallet: MFU-65II x 2
Conveyor type: Single conveyor

High accuracy placement

High rigidity construction with linear motor movement and high resolution cameras. Combines the optimum placement pressure, high accuracy, and high quality using advanced control technology.

Supports cleanroom class 1000

With the assumption that this machine is going to be used in cleanrooms, the XY robot is cleanroom capable.

By setting a HEPA filter, you can achieve an even better environment for semiconductors.

Easy operation

Equipped with a large 15 inch touchscreen panel and graphical interface. The united interface controls both machine and MWU12i operation.

Covers both wafer map data management and format conversion.

Individual user formats can be supported separately.

The vacuum soldering process and its advantages

Pores are reduced by up to 99% - optimized solder joint quality
2 and 3 lane transport possible
reliable transport handovers in the facility
Suitable for printed circuit boards, DCBs, lead frames and workpiece carriers
powerful vacuum pump (300 m³/h) fast and reliable vacuum process
Parameters can be set individually: evacuation time, vacuum holding time, ventilation time, vacuum pressure

‍

Building a vacuum soldering system

Vacuum module between peak and cooling zone
Stainless steel vacuum chamber
Inline system
Nitrogen capable
Vacuum and non-vacuum process possible
All vacuum parameters can be individually adjusted

Versions of vacuum systems

The vacuum systems can be individually configured. You can choose between different lengths for the heating zone, the vacuum module and the cooling zone. There is also the choice between one, two or three track versions.

V350
V450
V580

Vacuum S - heating zone length 3.0 m

Vacuum M heating zone length 3.4 m
Vacuum L - heating zone length 4.1 m
Vacuum L Plus - heating zone length 4.6 m
Vacuum XL Plus - heating zone length 5.6 m

Zone concept

Fewer zones - fewer fan units - less consumption!

The number of zones has no influence on a good ΔT . The system is aligned according to the process and defined by the heating chamber length - not by the number of zones. A high air volume
is important . SMT achieves this with few but powerful fans.

Small ΔT with perfect heat transfer
3 parts preheat (3 min) plus 1 part peak (1 min) corresponds to the 4 min IPC-JEDEC/solder paste recommendation

Process gas cleaning

Tool-free, easy maintenance from the front
lowest consumption of consumer goods
Process gas cleaning - ON THE SPOT
Cleaning directly in the process room
No extraction of process gases through piping necessary.

Cooling concept

The cooling zone length and equipment (heat exchanger plates, optimized air baffles, etc.) can be flexibly selected. The cooling medium is supplied via an integrated cooling unit or an external cooling tower or the domestic water supply.

Stable cooling performance, no loss of performance over the operating time thanks to the use of smooth cooling plates
Cooling plates with long service lives and planned maintenance (cannot “clog up”), no replacement of the cooling plates necessary
Easy to clean

‍

Intelligent nitrogen control

The intelligent nitrogen control with optimal control behavior reduces nitrogen consumption to a minimum. A nitrogen parameter that can be used for traceability is provided.

Lambda probe (automotive technology) in peak zone
Continuous live measurement of residual oxygen levels
Probe replacement (calibration) in < 10 minutes

process

Individual fan control in all zones

Individually adjustable fan speed in each zone (process optimization for flexible profile settings)
Increased energy saving potential
Active fan monitoring
Fan control is separate from the fan motors in the system (no thermal loads and therefore more durable)

Explanations

Our reflow systems can be individuallyconfigured.

R series

•R460 - heating zone length 4.6 m

•R410 - heating zone length 4.1 m

•R360 - heating zone length 3.6 m

•R320 - heating zone length 3.2 m

QP series

•Quattro Peak M - heating zone length 2.6 m

•Quattro Peak S - heating zone length 2.1 m

System features

Void-free solder connections
Soldering with preforms and / or pastes
Individual soldering profiles
Process temperatures
up to 400 °C
Controlled temperature gradients
Short cycle times
Separate soldering and cooling chamber or zones
Flux-free soldering with formic acid
Flux management
Inert gas atmosphere
Residual oxygen content < 5 ppm
Reproducibility of the soldering results
Traceability
Permanent process control
Ethernet interface
Remote maintenance (VPN)
Low energy and media consumption
Internationally patented system

· Size and weight of the tower varies according tothe size and quantity of themagazines.

· Dimension: 2200 * 1500 * 2150 (L*W*H/mm)

· Weight: 1400kg

· Magazinesize :320 * 355 * 575 (L*W*H/mm)

· Controlby : PC

3DMEASUREMENT FREE FROM SHADOWS AND DIFFUSE REFLECTIONS

•EAGELE 3D 8800 AOI applies 8-wayprojection for 3D measurement to all models to minimize errors due to shadow effects, and performs 100% 2D & 3Dinspection simultaneously in all FOV areas.

•As a result, it is possible tosecure close to perfect detection power while significantly reducing falsecalls.

ACCURATEAND CONVENIENT INSPECTION USING SIDE CAMERA
Real-time inspection is possible by simultaneously using fourhigh-definition cameras and a TOP camera on the side and using a dedicatedalgorithm optimized for side inspection.

•4-Way Side Camera(Option)

•Capable of detecting innerbridges that cannot be seen in the top camera

•Detection possible inside theconnector

•Convenient Teaching usingexisting algorithms
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3D measurement/inspection of 27mm high parts

EAGEL 3D AOI provides the option to inspect up to 30mm in height using Pemtron's proprietary technology.